Piezoelectric components
Complementary ceramic bars, discs, rings and wired assemblies for pickup, sensing and ultrasonic equipment. Explore these additional sourcing options when your project needs components alongside our core product lines.
Features & Applications
YJ Piezo · Complementary supply
Find your component
20 component configurations
20 mm 2.4 MHz Wired Atomizing Disc
A 20 mm ceramic atomizing disc with attached leads and a two-position connector. Its 2.4 MHz format is intended for integration with a matched ultrasonic atomizer driver.
25 mm 1.7 MHz Wired Atomizing Assembly
A wired atomizing assembly with a circular ceramic element, surrounding mounting ring and two-position connector. The nominal 25 mm, 1.7 MHz format supports integration into a dedicated humidifier assembly.
12 × 5 × 0.6 mm Piezoelectric Bimorph
A compact rectangular piezoelectric bimorph for integration into sensing and bending-element assemblies. The 12 × 5 mm footprint provides a small component format for a project-specific mechanical and electrical interface.
Representative appearance; confirm dimensions and construction against the drawing.
6 × 1.5 × 1.5 mm Ceramic Pickup Bar
A 6 × 1.5 × 1.5 mm piezoelectric ceramic bar for contact-pickup and vibration-sensing assemblies. The ceramic component is supplied for integration with a defined electrode connection, mechanical interface and input circuit.
Representative appearance; confirm dimensions and construction against the drawing.
10 × 1 × 1 mm Ceramic Pickup Bar
A 10 × 1 × 1 mm piezoelectric ceramic bar for contact-pickup and vibration-sensing assemblies. The ceramic component is supplied for integration with a defined electrode connection, mechanical interface and input circuit.
Representative appearance; confirm dimensions and construction against the drawing.
10 × 1.5 × 1 mm Ceramic Pickup Bar
A 10 × 1.5 × 1 mm piezoelectric ceramic bar for contact-pickup and vibration-sensing assemblies. The ceramic component is supplied for integration with a defined electrode connection, mechanical interface and input circuit.
Representative appearance; confirm dimensions and construction against the drawing.
10 × 1.5 × 1.5 mm Ceramic Pickup Bar
A 10 × 1.5 × 1.5 mm piezoelectric ceramic bar for contact-pickup and vibration-sensing assemblies. The ceramic component is supplied for integration with a defined electrode connection, mechanical interface and input circuit.
Representative appearance; confirm dimensions and construction against the drawing.
10 × 4 × 1.5 mm Ceramic Guitar Pickup Element
A 10 × 4 × 1.5 mm piezoelectric ceramic element for guitar, bass and other contact-pickup assemblies. The ceramic component is supplied for integration with a defined electrode connection, mechanical interface and input circuit.
Representative appearance; confirm dimensions and construction against the drawing.
12.7 × 2.1 mm Circular Pickup Element
A circular piezoelectric ceramic element for compact contact-pickup assemblies. Its nominal 12.7 mm diameter provides a round contact format for an application-specific mechanical and electrical interface.
12 mm Circular Ceramic Pickup Disc
A circular piezoelectric ceramic disc for contact-pickup component assemblies. Electrode pattern and polarization are specified together with the target instrument interface.
Representative appearance; confirm dimensions and construction against the drawing.
Slender Ceramic Guitar Pickup Strip
A slender rectangular piezoelectric ceramic strip for guitar and other contact-pickup assemblies. Length, width, thickness and electrode arrangement are specified to match the instrument mounting interface.
15.5 mm 2 MHz Ultrasonic Ceramic Disc
A circular piezoelectric ceramic disc for integration into ultrasonic transducer assemblies. The nominal 2 MHz format combines a 15.5 mm diameter with a patterned electrode interface.
6 × 4 × 1 mm Ultrasonic Ceramic Element
A rectangular piezoelectric ceramic element for compact ultrasonic sensing assemblies. Its 6 × 4 mm footprint provides a small interface for a defined acoustic stack and coupling arrangement.
5 × 2 mm Ultrasonic Ceramic Disc
A small circular piezoelectric ceramic element for ultrasonic sensing assemblies. The nominal 5 mm diameter supports a compact ceramic interface selected together with the transducer geometry and drive conditions.
10 × 1 mm Ultrasonic Ceramic Disc
A thin circular ceramic element for integration into custom ultrasonic sensing assemblies. The nominal 10 mm diameter and 1 mm thickness provide a defined geometry for the acoustic and mechanical interface.
12 × 8 mm Piezoelectric Ceramic Ring
A ring-shaped piezoelectric ceramic element for custom force-coupled sensing assemblies. Its annular geometry allows the mechanical load path and electrode interface to be defined around the application fixture.
12 × 6 × 1 mm Textile-Sensing Ceramic Plate
A rectangular piezoelectric ceramic plate for textile sensing and vibration-coupling assemblies. The nominal 12 × 6 mm format supports a defined mechanical contact and electrode connection.
Custom Square Piezoelectric Ceramic Plate
A square piezoelectric ceramic plate for drawing-based sensing and transducer projects. Dimensions, surface pattern and polarization are specified to match the target mechanical and electrical interface.
Custom Rectangular Piezoelectric Ceramic Elements
Rectangular piezoelectric ceramic elements for drawing-based sensing and electromechanical assemblies. Geometry, electrode coverage and polarization are selected together with the operating mode and installation envelope.
Leaded Ceramic Filter
A three-lead ceramic filter for frequency-selective electronic circuits. The encapsulated component is selected together with the required center frequency and source and load impedances.
Match the element to the assembly
Send the required geometry, electrode pattern, frequency or capacitance target, mounting arrangement and quantity. For pickup elements, include the mechanical contact and input circuit. For ultrasonic parts, include the driver and working medium.
Component supply and validation
These pages describe components rather than complete instruments. Detection accuracy, audio response, atomization output and other finished-device results depend on the complete assembly and its test conditions.
Sample availability, MOQ, lead time and required documentation are reviewed for each project.